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工艺介绍
process information

ICC offers a variety of processes from multiple vendor with feature size down to 0.13 micron
Foundry	Technology	Poly/Metal	Voltage	Process ID
Chartered	0.35 CMOS	1P 4M	3.3v	Logic, single gate 2L314-699-5TA
		1P 4M	3.3v/5v	Logic, dual gate 2L314-F6A-5TA
		2P 4M	3.3v	Mixed-mode, single gate 2A324-699-5TA
			3.3v/5v	Mixed-mode, dual gate 2A324-F6A-5TA
			3.3v/5v	Mixed-mode, dual gate, high poly resistor 2A324-F81-5TA
	0.18 CMOS	1P 6M	1.8V/3.3V	Mixed-mode,Logic,RF CH18
TSMC	0.25 CMOS	1P 5M	2.5v/3.3v	Logic CL025
	0.25 CMOS	1P 5M+	2.5v/3.3v	Mixed-mode, RF CM025
	0.35 CMOS	2P 4M	3.3V/5V	Logic TSMC35LOGIC
	0.35 CMOS	2P 4M	3.3V/5V	Mixed-mode TSMC35MIX
	0.18 CMOS	1P 6M	1.8V/3.3V	Logic TSMC18LOGIC
	0.18 CMOS	1P 6M	1.8V/3.3V	Mixed-mode,RF TSMC18MIX
	0.13 CMOS	1P 8M	1.2V/2.5V	Mixed-mode,Logic TSMC13
SMIC	0.13 CMOS	1P 8M	1.2V/2.5V	Logic SM13
	0.18 CMOS	1P 6M	1.8V/3.3V	Logic SL018
	0.35 EEPROM	2P 3M	3.3V/15.5V	Embedded EEPROM EE035
HJTC	0.18 CMOS	1P 6M	1.8V/3.3V	Logic HJC018
GSMC	0.18 CMOS	1P 6M	1.8V/3.3V	Mixed-mode,Logic GSMC18
	0.18 CMOS	4P6M	1.8V/3.3V	E-Flash GSMC18EE
	0.13 CMOS	1P7M	1.2V/3.3V	Mixed-mode,Logic GSMC13

如果需要了解更多工艺信息，请联系Mr.Shen Guo Rong ，E-mail: shen@icc.sh.cn